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Model estimates are informational, not investment advice. They are uncertain, may be wrong, and do not guarantee future prices.
Latest observed price
$52.19
Session change unavailableStatus checked Oct 25, 2026, 12:35 AM · America/New_York
Observed Sep 21, 2026, 8:00 PM UTC · Last available price
The latest observed price above is market data. Forecast starting prices are issuance-frozen values and are labelled separately in Model Forecast below.
Review the dated model forecast and five-factor Scorecard for AMKR. Each has its own availability and reference date; a score is a relative comparison, not a price prediction.
Lower Estimate (P10)
$22.51
-56.9%
Median Estimate (P50)
$62.84
+20.4% from starting price
Upper Estimate (P90)
$179.20
+243.4%
The estimate uses its dated starting price. It does not predict returns from today’s quote.
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Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.
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Risk / safety methodology: Safety describes recent price swings and distance from a recent high alongside cash flow and profitability. It is not a credit rating or a promise of protection from loss.
Multi-factor scoring at a glance
Individual factor readings · Shading shows available dimensions only. Overall requires all five scores and a comparable peer group.
A combined view of Value, Quality, Growth, Safety and Momentum. Review the factor breakdown alongside the total.
Scores and key insights for each dimension
How its fundamental growth measures compare.
How its valuation measures compare with the group.
How its profitability and operating quality compare.
How its price swings, distance from a recent high, cash flow and profitability compare.
How its recent price-trend measures compare.
All scores in this Scorecard describe relative characteristics as of the shown date, using historical market data and reported company information; higher scores on the 0–100 scale indicate more favorable characteristics in the relevant comparison group, and none forecasts future performance.
Higher scores indicate higher relative readings.
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Scores are relative comparisons, not absolute grades: companies with different coverage may be scored on different inputs. Peer positions and input coverage can differ by factor; use the displayed comparison group and date when comparing readings. An 80 is not an 80% chance of a price rise. These scores are not price forecasts or recommendations.
The rank with complete inputs compares only companies with every input for that factor, using the issued scores. Equal partial coverage percentages do not establish matching inputs. Current stockwide snapshots use matching input groups; older snapshots may use a smaller fixed group. Scores do not separately adjust for industry or company size. Growth readings do not establish multi-year persistence or separate share-count effects from EPS growth. Scores are independent of the selected forecast horizon.
Latest update · 2026-09-21
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Economic observations provide background. Observation periods and release dates can differ; these readings do not establish a company-specific effect.
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12-month forecast
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+20.2%
From $117.24 starting price
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RMBS
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$96.96
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12-month forecast
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$116.70
+20.4%
From $96.96 starting price
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Overall Score
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SWKS
Latest observed price
$88.74
Observed
Sep 21, 2026
12-month forecast
Median (P50)
$102.92
+16.0%
From $88.74 starting price
Target Sep 21, 2027
Overall Score
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Score date Sep 22, 2026
12-month forecasts show model median estimates (P50), with changes from each forecast’s starting price. Headline scores describe dated company characteristics; they do not predict future performance.
